Hong Kong-listed China Information Technology to issue bonds capped at HK$100 million using distributed ledger technology

China Information Technology Development Co., Ltd., a Hong Kong-listed company, disclosed in the announcement of the Hong Kong Stock Exchange that it will use distributed ledger technology (DLT) to issue bonds with a limit of 100 million Hong Kong dollars, and will use the digital ownership token (Digital Ownership Token) standard to implement . All bond documents, along with their corresponding smart contract code, will be loaded with bond security tokens using the DOT standard by reference to a binding Ricardian Contract. The bond issue period is from the initial issuance period to July 12, 2023, with a maturity date of June 27, 2053.